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Download Solution Manual to options futures and other derivatives by John Hull PDF

By John Hull

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Example text

In the manufacture of the cast aluminum housings, the top and bottom halves were mated along several polished (lapped) surfaces. Lapping involved positioning the housings on a large lapping table where a continuous supply of lapping compound was fed in with a carrier. The lapping compound used by the vendor was alumina, and the carrier was oil-based. This necessitated that, after lapping, the polished surfaces had to be cleaned by immersing in a methyl Design for Cleanability 41 chloroform or 1,1,l-trichloroethane(TCA) tank.

How the contaminants deposit on and adhere to the substrate, has often been overlooked. In order for the solvency of the cleaning agent to become less important, the parts and their manufacturing processes have to be designed in such a way that capillary forces of adhesion do not become predominant, or such that the capillary medium is easy to dissolve. Design of microelectronic components and subassemblies for nonsolvent cleanability is crucial. Rules for design for cleanability are included here as Appendix 1.

Finally, the contaminant partitions between the bulk liquid and the cleaning solvent, represented as P 4F' The partitioning processes are usually expressed in terms of equilibrium concentrations. This is because contaminant partitioning occurs back and forth between two phases. For example, in the case of PW, the contaminant can partition into the cleaning fluid and back into the liquid adsorbed on the substrate surface. If the contaminant is not very soluble in the cleaningfluid or ifthere is strong surface adsorbtion, the partitioning into the cleaning solvent is going to be small.

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